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Patent Searching and Data


Title:
METHOD FOR PRODUCING CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2017200995
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a conductive film, capable of suppressing a decrease in conductivity of a conductive film when forming the conductive film by stretching a coating layer formed using a coating liquid containing a conductive polymer.SOLUTION: The method for producing a conductive film includes the steps of: preparing a coating liquid which contains a binder and composite particles composed of a conjugated conductive polymer and polymer seed particles formed into protective colloids by a polyanion; coating a substrate with the coating liquid and drying the coating liquid to form a coating layer; and heat-stretching the coating layer to form a conductive film. The glass transition temperature of the polymer seed particles formed into protective colloids is lower than a stretching temperature in the heat stretching.SELECTED DRAWING: None

Inventors:
FUJITA MIYO
ARAKI MOTOAKI
OKUBO TAKASHI
Application Number:
JP2017065930A
Publication Date:
November 09, 2017
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L25/08; C08J5/18; C08L65/00; C08L101/00; H01B1/12; H01B1/20; H01B13/00
Domestic Patent References:
JP2016047502A2016-04-07
JP2016047501A2016-04-07
JP2016047500A2016-04-07
JP2004189796A2004-07-08
Foreign References:
WO2014142133A12014-09-18
US20160060497A12016-03-03
WO2014141367A12014-09-18
EP2975074A12016-01-20
Attorney, Agent or Firm:
Tamotsu Otani