A manufacturing method of electronic parts and the adhesive constituent for glass substrate processing, electronic parts and the pressure sensitive adhesive tape for glass substrate processing, and electronic parts and a glass substrate

Title:

Document Type and Number:

Japanese Patent JP6234824

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition for processing an electronic component/glass substrate that is used for protecting the electronic component/glass substrate in the manufacture of the electronic component/glass substrate in which at least a chemical cleaning step is performed, can easily be peeled off while having a high adhesive force and is excellent in chemical resistance, to provide a pressure-sensitive adhesive tape for processing an electronic component/glass substrate that uses the pressure-sensitive adhesive composition and to provide a method for manufacturing an electronic component/glass substrate.SOLUTION: The pressure-sensitive adhesive composition for processing an electronic component/glass substrate is used for protecting the electronic component/glass substrate in the manufacture of the electronic component/glass substrate in which at least a chemical cleaning step is performed, and comprises: a crosslinkable resin having a molecular weight distribution (Mw/Mn) of 1.05 to 2.50, which is produced by subjecting a monomer mixture containing a monomer having a functional group acting as a crosslinking point to living radical polymerization; and a crosslinking agent.

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Inventors:

Satoshi Hayashi
Daihei Sugita
Yuki Ishikawa
Yasushi Ishido

Application Number:

JP2014003613A

Publication Date:

November 22, 2017

Filing Date:

January 10, 2014

Export Citation:

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Assignee:

Sekisui Chemical Co.,Ltd.

International Classes:

C09J133/00; C09J7/02; C09J11/06; H01L21/304

Domestic Patent References:

JP2011074380A

Foreign References:

WO2007119884A1

Attorney, Agent or Firm:

Atomi International Patent Office

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