Title:
電子部品の製造方法、電子部品および導電性フィルム
Document Type and Number:
Japanese Patent JP5289291
Kind Code:
B2
Abstract:
Provided is a method for manufacturing an electronic component using a conductive film formed by layering an adhesive layer and a release layer. The method for manufacturing the electronic component having a wiring includes: disposing an adhesive film formed by layering an adhesive layer and a release layer above a substrate having a surface on which a wiring is formed, such that the adhesive layer faces the surface; cutting the adhesive layer by inserting the wiring into the adhesive layer by depressing the adhesive film to the substrate; separating one adhesive layer portion of the cut adhesive layer from the surface; and releasing the release layer from the other adhesive layer portion of the cut adhesive layer.
Inventors:
Okumiya Hideaki
Suga Yasuhiro
Suga Yasuhiro
Application Number:
JP2009273998A
Publication Date:
September 11, 2013
Filing Date:
December 01, 2009
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01B5/16; H01L21/60; H01L31/04; H05K3/32
Domestic Patent References:
| JP2008135646A | ||||
| JP2005327922A |
Foreign References:
| WO2009099042A1 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation