Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2018066786
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that can form a high-definition pattern in a short development time, and a cured film and the like prepared with the photosensitive resin composition.SOLUTION: A photosensitive resin composition contains (a) an alkali-soluble resin, (b) a photosensitizer, (c) a solvent, (d) a crosslinker that is crosslinkable or polymerizable by heating, and (e) a dissolution inhibitor. The (e) dissolution inhibitor is an ammonium salt having a structure represented by the following formula (1), or a phosphonium salt having a structure the following represented by formula (2).SELECTED DRAWING: Figure 1
Inventors:
KAWAMORI TAKASHI
HIDAKA TAKAHIRO
HIDAKA TAKAHIRO
Application Number:
JP2016203661A
Publication Date:
April 26, 2018
Filing Date:
October 17, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD
International Classes:
G03F7/023; C08G73/22; C09K3/00; G03F7/004; G03F7/20; G03F7/40
Domestic Patent References:
| JP2010060957A | 2010-03-18 | |||
| JP2012088459A | 2012-05-10 |
Attorney, Agent or Firm:
Heiwa International Patent Office