Title:
The manufacturing method and electronic parts of a photosensitive resin composition and a pattern hardening film
Document Type and Number:
Japanese Patent JP5953795
Kind Code:
B2
Inventors:
Masayuki Oe
Application Number:
JP2012030628A
Publication Date:
July 20, 2016
Filing Date:
February 15, 2012
Export Citation:
Assignee:
Hitachi Chemical DuPont Micro Systems Co., Ltd.
International Classes:
G03F7/023; C08G73/06; C08G73/10; G03F7/004
Domestic Patent References:
| JP2011150165A | ||||
| JP2006313237A | ||||
| JP2010079065A | ||||
| JP2008224984A |
Foreign References:
| WO2008111470A1 |
Attorney, Agent or Firm:
Kihei Watanabe
Yuko Tanaka
Yuko Tanaka