Title:
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND FILM-LIKE ADHESIVE
Document Type and Number:
Japanese Patent JP2017168850
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wire-embedded semiconductor device which exhibits good connection reliability even when a thinned semiconductor element is used, and to provide a manufacturing method of the semiconductor device and a film-like adhesive.SOLUTION: In a semiconductor device 200, a film-like adhesive 10 used for pressure bonding a second semiconductor element Waa on a first semiconductor element Wa has low elasticity after curing and exhibits low glass transition temperature Tg. Because of this, even when the thin second semiconductor element Waa is used, warpage of the semiconductor device 200 after curing can be suppressed. Accordingly, stress of the semiconductor device 200 is eased and a semiconductor device which exhibits good connection reliability can be obtained.SELECTED DRAWING: Figure 6
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Inventors:
TOKUYASU TAKAHIRO
KODAMA MEGUMI
SUGAI SHOTA
AOKI MASAYUKI
INABA NORIKO
OZAKI YOSHINOBU
SOBUE SHOGO
KODAMA MEGUMI
SUGAI SHOTA
AOKI MASAYUKI
INABA NORIKO
OZAKI YOSHINOBU
SOBUE SHOGO
Application Number:
JP2017082997A
Publication Date:
September 21, 2017
Filing Date:
April 19, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L25/065; C09J7/00; C09J11/04; C09J161/06; C09J163/00; C09J201/00; H01L21/56; H01L23/14; H01L23/29; H01L23/31; H01L25/07; H01L25/10; H01L25/11; H01L25/18
Domestic Patent References:
| JP2012216644A | 2012-11-08 | |||
| JP2012214526A | 2012-11-08 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hiromitsu Nakayama
Yoshinori Shimizu
Hiroyuki Hirano
Hiromitsu Nakayama