Title:
スピーカの振動板用フィルムの製造方法
Document Type and Number:
Japanese Patent JP6637919
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a film for diaphragm of a speaker capable of improving durability of a diaphragm by securing heat resistance at 150°C or higher.SOLUTION: A molding material 1 containing a polyetherketoneketone resin of which the glass transition point is high is molten and mixed and while using the molding material 1, a thin film 2 is continuously extruded from a T-die 13 and molded. The extruded and molded film 2 is cooled while being held between a crimping roll 17 and a cooling roll 18. Thus, thickness of the cooled film 2 is made equal to or more than 2 μm and equal to or less than 110 μm, a tension elasticity modulus of the cooled film 2 at 23°C is made equal to or more than 2000 N/mmand equal to or less than 4000 N/mm, and a tension elasticity modulus of the cooled film 2 at 150°C is made equal to or more than 2000 N/mmand equal to or less than 4000 N/mm. A specific gravity of the cooled film 2 is made equal to or more than 1.2 and equal to or less than 1.4, and a loss tangent of the cooled film 2 at 20°C is made equal to or more than 0.010.SELECTED DRAWING: Figure 1
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Inventors:
Takashi Gonda
Mikio Kishi
Mikio Kishi
Application Number:
JP2017090092A
Publication Date:
January 29, 2020
Filing Date:
April 28, 2017
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
H04R31/00; B29C48/305; B29C48/88; B29C48/92; H04R7/02
Foreign References:
| WO2016010127A1 |
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba