Title:
A manufacturing method of the film for temporary fastening, the film sheet for temporary fastening, and a semiconductor device
Document Type and Number:
Japanese Patent JP6209876
Kind Code:
B2
Abstract:
A method for producing a semiconductor device having a semiconductor element obtained by dividing a semiconductor wafer comprises a temporary securing step of arranging a temporary securing film between a support member and the semiconductor wafer so as to temporarily secure the support member and the semiconductor wafer to each other; a grinding step of grinding a surface on the side opposite from the temporary securing film of the semiconductor wafer temporarily secured to the support member, and a semiconductor wafer peeling step of peeling the temporary securing film from the ground semiconductor wafer, wherein a semiconductor wafer edge-trimmed on an outer peripheral part of a surface opposing the support member is used as the semiconductor wafer, and the temporary securing step arranges the temporary securing film on the inside of the edge-trimmed part.
Inventors:
Takashi Kawamori
Takashi Masuko
Shogo Sobue
Takashi Masuko
Shogo Sobue
Application Number:
JP2013134149A
Publication Date:
October 11, 2017
Filing Date:
June 26, 2013
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/304; C09J4/00; C09J7/02; C09J11/04; C09J11/06; C09J123/00; C09J163/00; C09J179/08; C09J183/04
Domestic Patent References:
| JP10330723A | ||||
| JP11092744A | ||||
| JP2012004200A | ||||
| JP2005026413A | ||||
| JP2005005447A | ||||
| JP2005191550A | ||||
| JP11100565A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Yoshinori Shimizu
Junichiro Sakamaki
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