Title:
Flexible printed circuit board and manufacturing method of flexible printed circuit board
Document Type and Number:
Japanese Patent JP6362444
Kind Code:
B2
Abstract:
A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL2, and the solid ground layers are arranged on an inner peripheral side of the curved portions.
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Inventors:
Fumihiko Matsuda
Application Number:
JP2014123753A
Publication Date:
July 25, 2018
Filing Date:
June 16, 2014
Export Citation:
Assignee:
Nippon Mektron Co., Ltd.
International Classes:
H01B7/08; H05K1/02
Domestic Patent References:
| JP2014011012A | ||||
| JP2012231018A | ||||
| JP64045190A | ||||
| JP2007281145A |
Foreign References:
| WO2013069763A1 |
Attorney, Agent or Firm:
Iat International Patent Business Corporation