Title:
A manufacturing method of a flexible printed wiring board
Document Type and Number:
Japanese Patent JP6039398
Kind Code:
B2
Inventors:
Tetsuya Ogiso
Yoshihide Kanto
Yoshihide Kanto
Application Number:
JP2012273865A
Publication Date:
December 07, 2016
Filing Date:
December 14, 2012
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
H05K3/28; C08F2/44; C08F2/46; C08G59/18; G03F7/004; G03F7/027
Domestic Patent References:
| JP2012237864A | ||||
| JP2008088403A | ||||
| JP54066485A |