Title:
A manufacturing method of the glue film for semiconductor chips with a penetration electrode, and the glue film for semiconductor chips with a penetration electrode
Document Type and Number:
Japanese Patent JP6030233
Kind Code:
B2
Abstract:
An adhesive film for a semiconductor chip with a through electrode, which is used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, which can favorably connect the through electrodes while suppressing formation of voids, and which can reduce the length of burrs protruding around the semiconductor chips. An adhesive film for a semiconductor chip with a through electrode, to be used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, the adhesive film having a minimum melt viscosity of 50 to 2500 Pa·s and a thixotropic index at 140° C. of 8 or lower.
Inventors:
Mai Nagata
Kohei Takeda
Toshio Gangnam
Kohei Takeda
Toshio Gangnam
Application Number:
JP2015517530A
Publication Date:
November 24, 2016
Filing Date:
March 25, 2015
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/60; C09J7/10; C09J11/04; C09J201/00; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2014045032A | 2014-03-13 | |||
| JP2009149727A | 2009-07-09 | |||
| JP2009124115A | 2009-06-04 | |||
| JP2008117916A | 2008-05-22 |
Foreign References:
| WO2009054255A1 | 2009-04-30 |
Attorney, Agent or Firm:
Atomi International Patent Office
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