Title:
硬化促進性化合物-シリカ複合体、硬化促進性化合物-シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
Document Type and Number:
Japanese Patent JP5157444
Kind Code:
B2
Abstract:
The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition. R1nSiR2(4-n) (I-1) wherein n is 0 or 1; R1 is selected from a hydrogen atom and a C1 to C18 substituted or unsubstituted hydrocarbon group and may form a ring structure with R2; R2s represent a functional group reactive with a phenolic hydroxyl group, are selected independently from a halogen atom, a hydroxyl group, a C1 to C18 optionally substituted oxy group, a C0 to C18 optionally substituted amino group, and a C2 to C18 optionally substituted carbonyloxy group, all R2s may be the same or different from one another, and two or more R2s may be bound to each other to form a ring structure.
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Inventors:
Shinya Nakamura
Application Number:
JP2007526859A
Publication Date:
March 06, 2013
Filing Date:
April 14, 2006
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G77/04; C08G59/68; C08G85/00; C08L63/00
Domestic Patent References:
JPH03122114A | 1991-05-24 | |||
JPH0625470A | 1994-02-01 | |||
JPH06184283A | 1994-07-05 | |||
JPH06256746A | 1994-09-13 | |||
JPS5337799A | 1978-04-07 | |||
JPS63223027A | 1988-09-16 | |||
JP2004277511A | 2004-10-07 | |||
JP2004300071A | 2004-10-28 | |||
JP2004149437A | 2004-05-27 | |||
JP2003525100A | 2003-08-26 | |||
JPH0977959A | 1997-03-25 | |||
JPH02300229A | 1990-12-12 | |||
JP2000186132A | 2000-07-04 | |||
JP2004156035A | 2004-06-03 | |||
JP2004156036A | 2004-06-03 | |||
JPH0977959A | 1997-03-25 | |||
JPH02300229A | 1990-12-12 | |||
JP2000186132A | 2000-07-04 | |||
JP2004156035A | 2004-06-03 | |||
JP2004156036A | 2004-06-03 | |||
JPH03122114A | 1991-05-24 | |||
JPH0625470A | 1994-02-01 | |||
JPH06184283A | 1994-07-05 | |||
JPH06256746A | 1994-09-13 | |||
JPS5337799A | 1978-04-07 | |||
JPS63223027A | 1988-09-16 | |||
JP2004277511A | 2004-10-07 | |||
JP2004300071A | 2004-10-28 | |||
JP2004149437A | 2004-05-27 | |||
JP2003525100A | 2003-08-26 |
Foreign References:
WO2003068840A1 | 2003-08-21 | |||
WO2003068840A1 | 2003-08-21 |
Other References:
JPN6011050912; Polymer Prepints Vol.41,No.2, 2000, P.1844
JPN6011050912; Polymer Prepints Vol.41,No.2, 2000, P.1844
JPN6011050912; Polymer Prepints Vol.41,No.2, 2000, P.1844
Attorney, Agent or Firm:
Hidekazu Miyoshi