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Title:
硬化促進性化合物-シリカ複合体、硬化促進性化合物-シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
Document Type and Number:
Japanese Patent JP5157444
Kind Code:
B2
Abstract:
The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition. R1nSiR2(4-n)  (I-1) wherein n is 0 or 1; R1 is selected from a hydrogen atom and a C1 to C18 substituted or unsubstituted hydrocarbon group and may form a ring structure with R2; R2s represent a functional group reactive with a phenolic hydroxyl group, are selected independently from a halogen atom, a hydroxyl group, a C1 to C18 optionally substituted oxy group, a C0 to C18 optionally substituted amino group, and a C2 to C18 optionally substituted carbonyloxy group, all R2s may be the same or different from one another, and two or more R2s may be bound to each other to form a ring structure.

Inventors:
Shinya Nakamura
Application Number:
JP2007526859A
Publication Date:
March 06, 2013
Filing Date:
April 14, 2006
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G77/04; C08G59/68; C08G85/00; C08L63/00
Domestic Patent References:
JPH03122114A1991-05-24
JPH0625470A1994-02-01
JPH06184283A1994-07-05
JPH06256746A1994-09-13
JPS5337799A1978-04-07
JPS63223027A1988-09-16
JP2004277511A2004-10-07
JP2004300071A2004-10-28
JP2004149437A2004-05-27
JP2003525100A2003-08-26
JPH0977959A1997-03-25
JPH02300229A1990-12-12
JP2000186132A2000-07-04
JP2004156035A2004-06-03
JP2004156036A2004-06-03
JPH0977959A1997-03-25
JPH02300229A1990-12-12
JP2000186132A2000-07-04
JP2004156035A2004-06-03
JP2004156036A2004-06-03
JPH03122114A1991-05-24
JPH0625470A1994-02-01
JPH06184283A1994-07-05
JPH06256746A1994-09-13
JPS5337799A1978-04-07
JPS63223027A1988-09-16
JP2004277511A2004-10-07
JP2004300071A2004-10-28
JP2004149437A2004-05-27
JP2003525100A2003-08-26
Foreign References:
WO2003068840A12003-08-21
WO2003068840A12003-08-21
Other References:
JPN6011050912; Polymer Prepints Vol.41,No.2, 2000, P.1844
JPN6011050912; Polymer Prepints Vol.41,No.2, 2000, P.1844
Attorney, Agent or Firm:
Hidekazu Miyoshi



 
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