Title:
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018022923
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive sheet which is superior in insulation while having high thermal conductivity and others.SOLUTION: A thermally conductive sheet comprises: a binder resin; carbon fiber; and a thermally conductive filler other than the carbon fiber. The mass ratio (Carbon fiber/Binder resin) of the carbon fiber to the binder resin is less than 1.30. The content of the thermally conductive filler is 48-70 vol.%. The carbon fiber is oriented in a thickness direction of the thermally conductive sheet.SELECTED DRAWING: Figure 2
Inventors:
KANAYA HIROKI
NOMURA MASARU
UCHIDA SHUNSUKE
UCHIDA SHINICHI
ARAMAKI KEISUKE
NOMURA MASARU
UCHIDA SHUNSUKE
UCHIDA SHINICHI
ARAMAKI KEISUKE
Application Number:
JP2017199376A
Publication Date:
February 08, 2018
Filing Date:
October 13, 2017
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
H01L23/373; B29C47/00; H01L23/36; H01L23/40; H05K7/20
Domestic Patent References:
| JP2007326976A | 2007-12-20 | |||
| JP2002088249A | 2002-03-27 | |||
| JP2012001638A | 2012-01-05 | |||
| JP2012023335A | 2012-02-02 | |||
| JP2015029071A | 2015-02-12 |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Takeshi Yamashita
Yoshihiro Nagare
Naoko Matsuda
Takeshi Yamashita
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