Title:
HEAT RADIATION PLATE MANUFACTURING APPARATUS, HEAT RADIATION PLATE MANUFACTURING METHOD, AND HEAT RADIATION PLATE COMPACT
Document Type and Number:
Japanese Patent JP2017213586
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To inhibit warpage deformation of a heat radiation plate manufactured by casing and facilitate process molding when the heat radiation plate is manufactured as a product.SOLUTION: A heat radiation plate manufacturing apparatus includes a casting mold having a heat radiation plate formation part 110, overflow formation parts 120A, 120B, and connection formation parts 121A, 121B. The heat radiation plate formation part 110 has a first surface 110f1 and a second surface 110f2. The overflow formation parts 120A, 120B have overflow formation part first surfaces 120Af1, 120Bf1 and overflow formation part second surfaces 120Af2, 120Bf2. Protrusion formation parts 130A, 130B are provided on at least one of the overflow formation part first surfaces 120Af1, 120Bf1 and the overflow formation part second surfaces 120Af2, 120Bf2.SELECTED DRAWING: Figure 2
Inventors:
TANAKA KEISUKE
OYA DAISUKE
ISHIHARA MIKIO
IWAASA TATSUYA
SAITO KOJI
WAKABAYASHI YUKI
OYA DAISUKE
ISHIHARA MIKIO
IWAASA TATSUYA
SAITO KOJI
WAKABAYASHI YUKI
Application Number:
JP2016109944A
Publication Date:
December 07, 2017
Filing Date:
June 01, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B22D19/00; B22D31/00; H05K7/20
Domestic Patent References:
| JP2007307609A | 2007-11-29 | |||
| JP2014082466A | 2014-05-08 | |||
| JP2011073024A | 2011-04-14 | |||
| JPS6431551A | 1989-02-01 | |||
| JPH0890211A | 1996-04-09 | |||
| JP2010232487A | 2010-10-14 | |||
| JP2012199452A | 2012-10-18 |
Foreign References:
| US6173758B1 | 2001-01-16 | |||
| US7521789B1 | 2009-04-21 |
Attorney, Agent or Firm:
Keigo Murakami
Masuo Oiwa
Kenji Yoshizawa
Takenaka Ikuo
Masuo Oiwa
Kenji Yoshizawa
Takenaka Ikuo