To improve detection sensitivity of a thermal infrared sensor by increasing an infrared absorption rate of an infrared-absorbing layer.
This thermal infrared sensor includes: an infrared-receiving section 11; and an infrared-absorbing film held through a hollow section on a circuit board 1 for transmitting heat acquired by thermally converting incident infrared rays to the infrared-receiving section 11. A projecting section or a recessed section having a width which is larger than the film thickness of the infrared-absorbing film, and less than ten times the film thickness is formed on an infrared-incident surface of the infrared-absorbing film and on a transmission surface on the hollow section side which is the rear surface of the incident surface.
COPYRIGHT: (C)2010,JPO&INPIT
Miyoshi Masaru
Kurashina Haruji
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