Title:
加熱装置及び基板処理装置並びに半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5584461
Kind Code:
B2
Inventors:
Akira Hayashida
Murata Etc.
Tetsuya Kosugi
Ueno Masaaki
Shimada Shin-ichi
Kimio Kitamura
Kenji Tanaka
Hasan Mass ドゥル
Junichi Nishihara
Jun Tsukada
Murata Etc.
Tetsuya Kosugi
Ueno Masaaki
Shimada Shin-ichi
Kimio Kitamura
Kenji Tanaka
Hasan Mass ドゥル
Junichi Nishihara
Jun Tsukada
Application Number:
JP2009293177A
Publication Date:
September 03, 2014
Filing Date:
December 24, 2009
Export Citation:
Assignee:
Hitachi Kokusai Electric, Inc.
Teitokusha Co., Ltd.
Teitokusha Co., Ltd.
International Classes:
H05B3/06; F27D11/02; H05B3/66
Attorney, Agent or Firm:
Koji Kitamura
Toshio Takao
Toshio Takao
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