Title:
INFRARED IMAGE SENSOR, AND METHOD OF MANUFACTURING INFRARED IMAGE SENSOR
Document Type and Number:
Japanese Patent JP2017168491
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the sensitivity of an infrared image sensor.SOLUTION: A method of manufacturing an infrared image sensor includes the steps of: dicing a compound semiconductor substrate 20 into individual pieces, the compound semiconductor substrate transmitting infrared rays therethrough and having one main surface 20a on which a plurality of pixels 22g detecting infrared rays are formed; after dicing, forming a coating film 48 of a resin transmitting infrared rays in a plurality of island shapes opposing respective pixels 22g, on the other main surface 20b of the compound semiconductor substrate 20; and forming each coating film 48 into a convex lens 48a by heating the coating film 48 to be melted and thereby to be formed in a hemispherical shape.SELECTED DRAWING: Figure 16
Inventors:
AOKI MASAKI
Application Number:
JP2016049485A
Publication Date:
September 21, 2017
Filing Date:
March 14, 2016
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L27/14; H01L27/144; H01L27/146
Attorney, Agent or Firm:
Keizo Okamoto