MANUFACTURING METHOD OF MULTILAYER CERAMIC ELECTRONIC COMPONENT

Japanese Patent JP2018098248

A

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer ceramic electronic component having an excellent cutting side surface.SOLUTION: A manufacturing method of a multilayer ceramic electronic component, comprises steps of: manufacturing a mother block including a plurality of laminated ceramic green sheets and an inner electrode pattern arranged along a plurality of boundary surfaces between the ceramic green sheets; acquiring a plurality of green chips that includes a lamination structure constructed by having a plurality of ceramic layers in a raw state and a plurality of inner electrodes 26 by cutting the mother block along first and second direction cutting-plane lines orthogonal each other, and in which each inner electrode 26 exposes to a cutting side surface 20 appeared by the cutting along the first direction cutting-plate line; eliminating a metal component of the cutting side surface 20; acquiring a raw component main body by forming a raw ceramic protection layer in the cutting side surface 20 obtained by eliminating the metal component; and burning the raw component main body.SELECTED DRAWING: Figure 9

FUJITA AKIRA
TAKAGI YUYA
MATSUI TOGO

JP2016238524A

June 21, 2018

December 08, 2016

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MURATA MANUFACTURING CO

H01G13/00; H01G4/12; H01G4/30

JP2012209539A	2012-10-25
JP2016225603A	2016-12-28
JPH03124012A	1991-05-27
JPH03123011A	1991-05-24
JP2017120880A	2017-07-06
JP2012209538A	2012-10-25

US20160351335A1

2016-12-01

Atomi International Patent Office

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