Title:
The manufacturing method, lamination substrate, and printed wired board of a lamination substrate
Document Type and Number:
Japanese Patent JP6067782
Kind Code:
B2
Inventors:
Toyomato Ito
Shen Chang
Shen Chang
Application Number:
JP2015105300A
Publication Date:
January 25, 2017
Filing Date:
May 25, 2015
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
B32B27/36; B05D7/24; H05K1/03; H05K3/28
Domestic Patent References:
| JP2005353751A | ||||
| JP2007238915A | ||||
| JP2009076663A | ||||
| JP2006319324A | ||||
| JP2007146139A |
Attorney, Agent or Firm:
Hiroshi Sano
Akio Ishii
Akio Ishii