Title:
A manufacturing method of a layer exfoliation resistance assembly
Document Type and Number:
Japanese Patent JP6185465
Kind Code:
B2
Abstract:
The present application is directed to a method of reducing delamination in an assembly. The method comprises providing an assembly and limiting visible light exposure to parts of the assembly to maintain a peel force of 20 grams/inch or greater where the light is limited. The assembly comprises an electronic device, a substrate having a first surface and a second surface opposite the first surface, wherein the second surface of the substrate is disposed on the electronic device, a barrier stack disposed on the first surface of the substrate, and a weatherable sheet adjacent the barrier film opposite the substrate. The assembly is transmissive to visible and infrared light.
Inventors:
Mark Dee Weigel
Andrew Tea. Rough
Tracy Jay Bernard
Andrew Tea. Rough
Tracy Jay Bernard
Application Number:
JP2014523962A
Publication Date:
August 23, 2017
Filing Date:
July 24, 2012
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
H01L31/048
Domestic Patent References:
| JP1223777A | ||||
| JP2000174296A | ||||
| JP2006173298A | ||||
| JP2009073071A | ||||
| JP2011124428A | ||||
| JP2011051195A |
Foreign References:
| US20090090412 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
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