A manufacturing method of a layered product and a layered product, and a manufacturing method of a printed-circuit board

Title:

A manufacturing method of a layered product and a layered product, and a manufacturing method of a printed-circuit board

Document Type and Number:

Japanese Patent JP5971960

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide: an uncuring adhesive resin excellent in alkali processability before curing and heat resistance after curing; a laminate obtained by laminating the same on a metal foil; and a method for manufacturing a printed wiring board using the laminate.SOLUTION: A uncuring adhesive resin is characterized in that a thermogravimetric reduction at 260°C measured by a temperature-rising condition of 10°C/minute from 40°C by a thermogravimetric analysis (TG) is at most 0.7%, and an alkali dissolution rate to a sodium hydroxide solution of 3 mass% at 50°C is at least 0.3 μm/sec, in a state before curing.

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Inventors:

Koichiro Shimoda
Masaki Yamamoto
Yasushi Iizuka
Adachi Hiroaki
Hiroaki Sasaki

Application Number:

JP2012010516A

Publication Date:

August 17, 2016

Filing Date:

January 20, 2012

Export Citation:

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Assignee:

ASAHI KASEI KABUSHIKI KAISHA

International Classes:

C09J7/02; B32B15/08; C09J7/00; C09J11/06; C09J179/08; C09J201/02; H05K1/03

Domestic Patent References:

JP6172713A
JP6172714A
JP5331425A
JP9045816A
JP5202347A
JP2005171211A
JP7026391A
JP2006342287A
JP2010238852A
JP2007051215A
JP2008248114A
JP2011228493A

Foreign References:

WO2010053185A1

Attorney, Agent or Firm:

Hiroyoshi Aoki
Amada Masayuki
Masayoshi Miwa

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