Title:
ELECTROLYTIC COPPER PLATING SOLUTION FOR FLEXIBLE WIRING BOARD, AND METHOD FOR PRODUCING LAMINATE BY USING SAID ELECTROLYTIC COPPER PLATING SOLUTION
Document Type and Number:
Japanese Patent JP2016102248
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electrolytic copper plating solution capable of forming a copper coating that has an excellent plated surface smoothness as well as that does not, with a lapse of time, warp into a concave shape toward the plating surface side.SOLUTION: Provided is an electrolytic copper plating solution for flexible wiring board containing copper sulfate by 60 g/L or more and 120 g/L or less, sulfuric acid by 120 g/L or more and 240 g/L or less, chlorine by 30 mg/L or more and 100 mg/L or less, and an additive. In the additive, a sulfur-based additive by 1 mg/L or more and 50 mg/L or less, an auramine-based additive by 0.5 mg/L or more and 30 mg/L or less, and a polymer component by 2 g/L or more and 50 g/L or less are contained. The copper coating formed by the electrolytic copper plating solution has a uniform smoothness with less convexoconcave as well as has less warpage amount.SELECTED DRAWING: None
Inventors:
SAITO KOICHI
Application Number:
JP2014241740A
Publication Date:
June 02, 2016
Filing Date:
November 28, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C25D3/38; C25D1/00; C25D1/04
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi