Title:
COPPER ELECTROPLATING SOLUTION FOR FLEXIBLE WIRING BOARD AND METHOD FOR PRODUCING LAMINATE USING THE COPPER ELECTROPLATING SOLUTION
Document Type and Number:
Japanese Patent JP2016113644
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper electroplating solution that is excellent in surface smoothness of a plated surface and forms a copper coating film causing no concave warpage toward the surface side of the plating with the lapse of time.SOLUTION: The copper-electroplating solution for a flexible wiring board includes copper sulfate, sulfuric acid, chlorine and an additive. The additive includes not less than 1 mg/L to not more than 50 mg/L of a brightener, not less than 0.5 mg/L to not more than 30 mg/L of a leveler, not less than 2 g/L to not more than 50 g/L of a polymer component and not less than 1 mg/L to not more than 100 mg/L of a compound having a mercapto group and at least one cyclic structure. The leveler is at least one compound selected from the group consisting of janus green B, thiourea, benzothiazole and safranine. A copper coating film formed by using the copper electroplating solution has a small amount of warpage and is excellent in dimensional stability.SELECTED DRAWING: None
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Inventors:
SAITO KOICHI
HATTORI TAKAHIRO
HATTORI TAKAHIRO
Application Number:
JP2014251231A
Publication Date:
June 23, 2016
Filing Date:
December 11, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C25D3/38; C25D1/00; C25D1/04; H05K3/18
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi