Title:
A manufacturing method of a luminescent device
Document Type and Number:
Japanese Patent JP6217711
Kind Code:
B2
Abstract:
A method of manufacturing a light emitting device includes: providing on a mounting substrate a soluble member which is soluble in a solvent and which has a lower surface, an upper surface opposite to the lower surface in a height direction, and an outer side surface provided between the lower surface and the upper surface, the lower surface contacting the mounting substrate; providing a light blocking member made of resin to cover the outer side surface of the soluble member so that an inner side wall of the light blocking member contacts the outer side surface of the soluble member; removing the soluble member using the solvent to provide a recess surrounded by the inner side wall of the light blocking member; and mounting a light emitting element in the recess.
Inventors:
Hiroto Tamaki
Application Number:
JP2015163422A
Publication Date:
October 25, 2017
Filing Date:
August 21, 2015
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/58; H01L33/52; H01L33/60
Domestic Patent References:
| JP2013221077A | ||||
| JP2011040488A | ||||
| JP2011526418A | ||||
| JP2013157419A | ||||
| JP2013187545A | ||||
| JP2015103632A | ||||
| JP2013004807A |
Foreign References:
| US20120097986 | ||||
| US20130001629 | ||||
| US20120098006 |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office