Title:
A manufacturing method of a metal-ceramic circuit board
Document Type and Number:
Japanese Patent JP6162986
Kind Code:
B2
Inventors:
Deno
Kudo Fumibun
Kitamura Seihiro
Kudo Fumibun
Kitamura Seihiro
Application Number:
JP2013054595A
Publication Date:
July 12, 2017
Filing Date:
March 18, 2013
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
C23F11/00; C23F1/00; G01N33/00; H05K3/28
Domestic Patent References:
| JP2003112980A | ||||
| JP2005064241A | ||||
| JP61056286A | ||||
| JP6322551A | ||||
| JP2009530846A | ||||
| JP59117501A | ||||
| JP2012231035A | ||||
| JP2007081217A | ||||
| JP3537417B2 | ||||
| JP5545234B2 | ||||
| JP2004158884A | ||||
| JP2003197827A |
Foreign References:
| US20030068532 | ||||
| WO2007111757A2 |
Attorney, Agent or Firm:
Koichi Okawa