Title:
A manufacturing method of a metal particulate dispersing element, a copper particulate dispersing element, and a copper particulate dispersing element, and a manufacturing method of a conductive board
Document Type and Number:
Japanese Patent JP5982033
Kind Code:
B2
Abstract:
Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.
Inventors:
Mikiko Hojo
Yoneda Shinya
Naobu Ki
Takeshi Sato
Takao Matsumoto
Yoneda Shinya
Naobu Ki
Takeshi Sato
Takao Matsumoto
Application Number:
JP2015066808A
Publication Date:
August 31, 2016
Filing Date:
March 27, 2015
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
Dnp Fine Chemicals Co., Ltd.
Dnp Fine Chemicals Co., Ltd.
International Classes:
H01B1/22; B22F1/0545; B22F1/107; B22F9/00; B22F9/20; C09D11/52; H01B13/00
Domestic Patent References:
| JP2009240970A | ||||
| JP2004256857A | ||||
| JP2008243946A |
Foreign References:
| WO2009060803A1 | ||||
| WO2005099941A1 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa
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