Title:
A manufacturing method of metallic powder, a manufacturing method for the same, conductive paste, and lamination ceramic electronic parts
Document Type and Number:
Japanese Patent JP5966365
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that, for matching the shrinkage behavior upon co-firing between an internal electrode and a ceramic layer as much as possible, and as metal powder included in conductive paste forming the internal electrode, the one in which the grain thereof is covered with an oxide for thermal shrinkage suppression is frequently used, but the oxide may be peeled when temperature is made high in a firing process.SOLUTION: A particle 1 composing metal powder includes: a core material 2 consisting of a metal as a main component; and an external layer 3 consisting of an oxide which is arranged so as to cover at least a part of the outer surface of the core material 2. Further, the particle 1 includes an intermediate layer 4 formed along the boundary face between the core material 2 and the external layer 3. The intermediate layer 4 has a thickness of ≥0.2 nm and also includes the oxide of the metal used as a main component of the core material 2 formed by subjecting the core material 2 to heat treatment in an oxygen-containing atmosphere, wherein the oxide is different from the oxide composing the external layer 3. The intermediate layer 4 acts so as to suppress the peeling of the external layer 3 from the core material 2.
Inventors:
Toshihiro Suzuki
Toru Nakanishi
Naoaki Ogata
Toru Nakanishi
Naoaki Ogata
Application Number:
JP2011290196A
Publication Date:
August 10, 2016
Filing Date:
December 29, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B22F1/02; B22F1/00; B82Y30/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00; H01G4/12; H01G4/232; H01G4/30
Domestic Patent References:
| JP2000178602A | ||||
| JP2009137822A | ||||
| JP2007035850A | ||||
| JP2000106035A | ||||
| JP2007332446A |
Attorney, Agent or Firm:
Masaaki Koshiba