Title:
応力に関連した温度測定誤差を除去するように構成されたマイクロワイヤ温度センサおよびそのセンサの製造方法
Document Type and Number:
Japanese Patent JP2014507671
Kind Code:
A
Abstract:
Improved, highly accurate microwire sensors (10) include a microwire assembly (14) including at least one primary, temperature-sensing microwire (16) encased within a closed-ended, stress-absorbing protective tube (12). Preferably, the sensor assembly (14) includes a plurality of microwires, e.g., a primary temperature-sensing microwire (16), a reference microwire (18), and a calibration microwire (20). The sensors (10) may be embedded within a heat-treatable or curable material (24) to monitor the temperature of the material (24) over a selected temperature range, e.g., during a pre- and/or post-curing temperature range. The tube (12) is formed of material which does not appreciably magnetically bias the microwire assembly (14), and substantially prevents forces exerted on the tube (12) from distorting the sensor assembly (14).
Inventors:
Crosia Brian El.
Application Number:
JP2013557828A
Publication Date:
March 27, 2014
Filing Date:
March 07, 2012
Export Citation:
Assignee:
TS Technologies Technologies LLC
International Classes:
G01K7/36; G01K1/08
Domestic Patent References:
| JP2000146714A | 2000-05-26 | |||
| JP2009543025A | 2009-12-03 | |||
| JP2009288023A | 2009-12-10 | |||
| JPH0575631U | 1993-10-15 | |||
| JPH1183641A | 1999-03-26 |
Foreign References:
| US20100006562A1 | 2010-01-14 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Haruko Sanwa
Hideaki Ito