Title:
PRODUCTION METHOD OF MILLIMETER WAVE-TRANSMISSIBLE RESIN MEMBER OBTAINED BY FORMING METALLIC FILM ON RESIN SUBSTRATE, AND MILLIMETER WAVE-TRANSMISSIBLE RESIN MEMBER
Document Type and Number:
Japanese Patent JP2017088923
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a production method of a millimeter wave-transmissible resin member having lower production cost than the case for forming a metallic film by using indium, and further having jointly high millimeter wave transmissivity and sufficient metallic sheen.SOLUTION: A production method of a millimeter wave-transmissible resin member has an A-layer formation step for forming an A-layer comprising tin or a tin alloy by a sputtering method or a vacuum deposition method on one surface of a substrate comprising a transparent resin, and a B-layer formation step for forming a B-layer comprising aluminum or an aluminum alloy layer on a surface on the opposite side to the surface having a contact with the substrate of the A-layer.SELECTED DRAWING: None
Inventors:
TSUCHINAGA KENJI
SAITO TAKAYUKI
SAKAMURA TAKASHI
MIYAZAKI TOSHIYUKI
SAITO TAKAYUKI
SAKAMURA TAKASHI
MIYAZAKI TOSHIYUKI
Application Number:
JP2015217147A
Publication Date:
May 25, 2017
Filing Date:
November 04, 2015
Export Citation:
Assignee:
UEHARA NAME PLATE KOGYO KK
HOKKAIDO RES ORGANIZATION
HOKKAIDO RES ORGANIZATION
International Classes:
C23C14/20; B32B15/08; C23C14/14
Domestic Patent References:
| JP2006281591A | 2006-10-19 | |||
| JP2007138270A | 2007-06-07 | |||
| JP2010030215A | 2010-02-12 | |||
| JP2011140126A | 2011-07-21 |
Attorney, Agent or Firm:
Patent Business Corporation Lighthouse International Patent Office