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Title:
モールド成形体の製造方法
Document Type and Number:
Japanese Patent JP4618211
Kind Code:
B2
Abstract:

To provide an in-mold molded body having a high corona generating voltage, a narrow interval between metal plates, and an easy assembling work, and its manufacturing method.

The in-mold molded body is manufactured by providing layers 1 of adhesive materials on both faces of an insulating polymer film 2, bonding sheet-like metal bodies 3 on the layers 1 of the adhesive materials, and molding the two faces with outer layer insulating polymers 6 in a mold. When the sheet-like metal bodies 3 are bonded on the insulating polymer film 2, the adhesion is performed so that the end parts 5 of the sheet-like metal bodies 3 are covered with the adhesive materials, and thereafter, the surroundings of these bonded articles are molded with the outer layer insulating polymers 6 in the mold.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Around Iwasaki
Takanori Yamazaki
Takiyoshi Taki
Application Number:
JP2006208359A
Publication Date:
January 26, 2011
Filing Date:
July 31, 2006
Export Citation:
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Assignee:
Hitachi Cable Ltd.
International Classes:
B29C43/18; B29C43/20; H01B19/00; B29K105/22; B32B15/08; H01B17/62
Domestic Patent References:
JP200532465A
JP2001196741A
Attorney, Agent or Firm:
Nobuo Kinutani



 
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