Title:
A manufacturing method of a mold package
Document Type and Number:
Japanese Patent JP6032171
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a mold package, capable of preventing a mold resin from adhering to a side surface of a sensor chip.SOLUTION: In a first step, a workpiece comprising a lead frame 4 is prepared. The lead frame 4 includes: a circuit chip 2; a sensor chip 3; an island portion 4a; and a sensor chip support 4c. In a second step, the workpiece is disposed on a mold 9 in a state where the sensor chip 3 is sandwiched between an upper mold 9a and a lower mold 9b, and a resin film 10 is arranged between the lower mold 9b and the sensor chip 3. In a third step, the island portion 4a is sealed with a mold resin 6 so that a second end 3b of the sensor chip 3 is protruded from the mold resin 6. In this state, the mold resin 6 is cast into a cavity 91 through between the lower mold 9b and a second surface 10b opposite to a surface facing the sensor chip 3, of the resin film 10. Thus, it is possible to prevent the mold resin 6 from adhering to a side surface 3e of the sensor chip 3.
Inventors:
Masaaki Tanaka
Tetsuto Yamagishi
Tetsuto Yamagishi
Application Number:
JP2013210445A
Publication Date:
November 24, 2016
Filing Date:
October 07, 2013
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/56
Domestic Patent References:
| JP2013016686A | ||||
| JP2013096970A | ||||
| JP2004140201A |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office