Title:
A manufacturing method of a multilayer chip box information-and-telecommunications object
Document Type and Number:
Japanese Patent JP6015918
Kind Code:
B2
Inventors:
Yoshikazu Kimura
Masato Tsuchiya
Masato Tsuchiya
Application Number:
JP2012218054A
Publication Date:
October 26, 2016
Filing Date:
September 11, 2012
Export Citation:
Assignee:
Kady Kay Co., Ltd.
International Classes:
B42D15/02
Domestic Patent References:
JP201256304A | ||||
JP200491989A | ||||
JP2012158163A |
Previous Patent: A power generator, electronic equipment, and a transportation device
Next Patent: MANUFACTURE OF SEMICONDUCTOR ELEMENT
Next Patent: MANUFACTURE OF SEMICONDUCTOR ELEMENT