Title:
A manufacturing method of a multilayer printed wiring board
Document Type and Number:
Japanese Patent JP5975011
Kind Code:
B2
Inventors:
Shigeo Nakamura
Yokota Tadahiko
Yokota Tadahiko
Application Number:
JP2013235320A
Publication Date:
August 23, 2016
Filing Date:
November 13, 2013
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
H05K3/46; B23K26/00; H05K3/00; H05K3/40; H05K3/42
Domestic Patent References:
| JP2005286089A | ||||
| JP2007273165A | ||||
| JP2001196743A | ||||
| JP2000022297A | ||||
| JP2007291368A | ||||
| JP11145626A |
Attorney, Agent or Firm:
Takashima Ichi
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Kenji Yamamoto
Murata Miyuki
Junzo Koike
Hirofumi Toma
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Kenji Yamamoto
Murata Miyuki
Junzo Koike
Hirofumi Toma