Title:
A manufacturing method of a multilayer type thermal conductivity sheet and a multilayer type thermal conductivity sheet
Document Type and Number:
Japanese Patent JP6261386
Kind Code:
B2
Abstract:
Peeling due to interfacial fracture between a tack-free layer 11 and a heat-conductive layer is prevented. In the tack-free layer, an inorganic filler having a median diameter of 0.5 μM or more is contained in a thermoplastic resin having a glass transition temperature of 60° C. or higher to form concaves and convexes on an adhesive surface. Then, the heat-conductive layer being in contact with the adhesive surface is disposed. The adhesion between the tack-free layer and the heat-conductive layer is strengthened by an anchor effect caused by the concaves and convexes of the adhesive surface, without strengthening the adhesion of the surface opposite to the adhesive surface.
Inventors:
Junichiro Sugita
Application Number:
JP2014041872A
Publication Date:
January 17, 2018
Filing Date:
March 04, 2014
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| JP2009241440A | ||||
| JP2006121051A | ||||
| JP2013149782A | ||||
| JP2006241333A | ||||
| JP2002176126A | ||||
| JP2013101999A |
Foreign References:
| US20130140014 | ||||
| WO2012132691A1 |
Attorney, Agent or Firm:
Shigeo Ishijima
Hideki Abe
Hideki Abe