Title:
A manufacturing method of a multilevel interconnection board
Document Type and Number:
Japanese Patent JP6190735
Kind Code:
B2
Inventors:
Hidenori Hayashida
Application Number:
JP2014018895A
Publication Date:
August 30, 2017
Filing Date:
January 16, 2014
Export Citation:
Assignee:
World Metal Co., Ltd.
International Classes:
H05K3/46
Domestic Patent References:
| JP2003101245A | ||||
| JP2132881A | ||||
| JP2007027454A | ||||
| JP2007329452A | ||||
| JP2008130579A | ||||
| JP2008021843A |
Attorney, Agent or Firm:
Eiwa patent office
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