Title:
Ni-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING THE SAME, AND METHOD FOR PRODUCING Ni-COATED COPPER POWDER
Document Type and Number:
Japanese Patent JP2017066463
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a dendritic Ni-coated copper powder capable of preventing agglomeration, thereby being suitably used for conductive pastes, electromagnetic shields or the like, while increasing the number of contact points when Ni-coated dendritic copper powders contact with one another to ensure excellent conductivity.SOLUTION: An Ni-coated copper powder is formed in a dendritic shape having a plurality of branches, by agglomerating copper particles 2, the surfaces of which are coated with Ni or Ni alloy, wherein the copper particles 2, the surface of which are coated with Ni or Ni alloy, are in ellipsoids having an average minor axis diameter of 0.2 to 0.5 μm and an average major axis diameter of 0.5 to 2.0 μm. The copper powder formed by agglomerating the copper particles 2 in ellipsoids, the surface of the copper powder being coated with Ni or Ni alloy, has an average particle diameter (D50) of 5.0 to 20 μm.SELECTED DRAWING: Figure 1
Inventors:
OKADA HIROSHI
Application Number:
JP2015192151A
Publication Date:
April 06, 2017
Filing Date:
September 29, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B22F1/00; B22F1/02; C22C19/03; H01B1/00; H01B1/22; H01B13/00; H05K9/00
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi