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Title:
OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2016100385
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which can properly protect a semiconductor optical element by a resin part.SOLUTION: A semiconductor device comprises: a substrate 2; a first electrode 3 which is provided on an external surface of the substrate 2 and has a die bonding pad 3a; a light emitting element 6 which has an outer shape smaller than the die bonding pad 3a and which is provided on the die bonding pad 3a; an annular stepped part 9 provided on the die bonding pad 3a so as to surround the light emitting element 6; and a resin part 7 provided to surround an outside of the stepped part 9.SELECTED DRAWING: Figure 1

Inventors:
HASEGAWA KATSUHISA
Application Number:
JP2014234306A
Publication Date:
May 30, 2016
Filing Date:
November 19, 2014
Export Citation:
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Assignee:
PIONEER ELECTRONIC CORP
PIONEER MICRO TECH CORP
International Classes:
H01L33/60; H01L23/02; H01L23/08; H01L31/02; H01L33/62
Domestic Patent References:
JP2009503888A2009-01-29
JP2005136378A2005-05-26
JP2008060344A2008-03-13
JP2014187081A2014-10-02
JP2014135489A2014-07-24
JP2011119557A2011-06-16
JP2010199275A2010-09-09
JP2007189182A2007-07-26
JP2014072415A2014-04-21
JP2014072414A2014-04-21
JP2013149866A2013-08-01
JP2013138148A2013-07-11
JP2013125776A2013-06-24
JP2013030572A2013-02-07
JP2012531761A2012-12-10
JP2012084810A2012-04-26
Foreign References:
WO2014037263A12014-03-13
US20110249424A12011-10-13
WO2009116744A22009-09-24
WO2009075530A22009-06-18
US20070222041A12007-09-27
Attorney, Agent or Firm:
Shinryo International Patent Office



 
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