光半導体保護材及びその前駆体並びに光半導体保護材の製造方法

Title:

光半導体保護材及びその前駆体並びに光半導体保護材の製造方法

Document Type and Number:

Japanese Patent JPWO2011132589

Kind Code:

A

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Inventors:

Akira Horai
Takahiro Iwahama
鄭 Takahiro
Ryuta Tomoyose

Application Number:

JP2011059217W

Publication Date:

July 18, 2013

Filing Date:

April 13, 2011

Export Citation:

Assignee:

ダイセル, Inc.

International Classes:

C08G61/06; C08F232/00; C08L23/02; C08K5/5425; H01L31/042

Attorney, Agent or Firm:

Atsuo Kuwata
Hiroshi Sakanaka

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