Title:
光半導体保護材及びその前駆体並びに光半導体保護材の製造方法
Document Type and Number:
Japanese Patent JPWO2011132589
Kind Code:
A
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Inventors:
Akira Horai
Takahiro Iwahama
鄭 Takahiro
Ryuta Tomoyose
Takahiro Iwahama
鄭 Takahiro
Ryuta Tomoyose
Application Number:
JP2011059217W
Publication Date:
July 18, 2013
Filing Date:
April 13, 2011
Export Citation:
Assignee:
ダイセル, Inc.
International Classes:
C08G61/06; C08F232/00; C08L23/02; C08K5/5425; H01L31/042
Attorney, Agent or Firm:
Atsuo Kuwata
Hiroshi Sakanaka
Hiroshi Sakanaka
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