Title:
A manufacturing method of an organic semiconductor element
Document Type and Number:
Japanese Patent JP6086781
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To form a microscopic wiring pattern which uses printing and has high productivity without causing a defect of an organic semiconductor film in manufacturing of a top contact organic semiconductor element having the organic semiconductor film.SOLUTION: An organic semiconductor element manufacturing method comprises: forming a large wiring pattern which passes above an organic semiconductor film and has at least one of line and space of over 20 μm by using printing and the like; and processing the wiring pattern on the organic semiconductor film by a plurality of times scanning by electromagnetic beams of a continuous wave having a spot diameter of 2 μm or less and under at a pitch not greater than a beam diameter.
Inventors:
Yuhisa Usami
Application Number:
JP2013068984A
Publication Date:
March 01, 2017
Filing Date:
March 28, 2013
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H01L21/336; H01L21/28; H01L21/302; H01L21/3213; H01L21/768; H01L29/786
Domestic Patent References:
| JP2011176126A | ||||
| JP2010109337A | ||||
| JP1169942A | ||||
| JP2006040711A | ||||
| JP2005277202A | ||||
| JP6314592A | ||||
| JP8222371A | ||||
| JP2003309268A | ||||
| JP2012038924A |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi