Title:
A manufacturing method of an oxygen-free-high-conductivity-copper rod
Document Type and Number:
Japanese Patent JP5976434
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing an oxygen-free copper rod, which allows the production of a copper rod having a low oxygen content and not adhering even if a mutual contact state of copper wire materials is maintained.SOLUTION: A thick copper rod 31 with a large diameter is formed by allowing a copper seed wire to traverse a coating chamber 6, connected with a holding furnace 5 holding molten copper, to stick the molten copper on the surface of the seed wire. The oxygen-free copper rod is prepared by sequentially subjecting the copper rod to cooling, hot rolling, recooling, and winding steps. The temperature of the holding furnace for keeping the molten copper warm is 1,140 to 1,180°C, and the temperature of the copper rod stuck with the molten copper before entering the hot rolling step after being cooled is 600 to 800°C. The temperature during winding is higher than room temperature and lower than 100°C. Thereby, a high quality copper wire material having an oxygen content of 2-10 ppm is produced. Further, mutual adhering of the wire materials is suppressed in an annealing step during winding by forming a specific oxide film.
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Inventors:
Sheep Rei Gold
Yu
Lu Hai On
Sheng Jung Army
Yu
Lu Hai On
Sheng Jung Army
Application Number:
JP2012162533A
Publication Date:
August 23, 2016
Filing Date:
July 23, 2012
Export Citation:
Assignee:
FUTONG GROUP CO., LTD.
International Classes:
C23C2/38; B21B1/46; B21B3/00; B21B37/76; B22D23/04
Domestic Patent References:
| JP46000953B1 | ||||
| JP60261658A | ||||
| JP59177809A |
Attorney, Agent or Firm:
Koichi Washida