Title:
A manufacturing method of a package and a package
Document Type and Number:
Japanese Patent JP6245086
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve such a problem that the position of a through via deviates significantly from a design value after firing, because the through via is manufacture simultaneously when manufacturing a LTCC by firing at a temperature of 1000°C or less, and thereby it is required to increase the size of a facing electrode by considering the deviation.SOLUTION: In a package including a facing board on which an electronic component is mounted, a multilayer board having a through via and a cavity, and housing the electronic component in the cavity by being bonded to the facing board, and a via electrode that is a part of the through via and projecting into the cavity, before being connected with an opposite electrode provided on the facing board, a deformable portion having rigidity lower than that at the tip of the via electrode is provided closer to the multilayer board side than the tip of the via electrode. Consequently, the size of the opposite electrode can be reduced.
Inventors:
Nobuaki Konno
Yoshiaki Hirata
Yasuhiko Ito
Aki Naito
Yoshiaki Hirata
Yasuhiko Ito
Aki Naito
Application Number:
JP2014122981A
Publication Date:
December 13, 2017
Filing Date:
June 16, 2014
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/04; H01L21/60; H01L23/02; H01L23/08; H01L23/12
Domestic Patent References:
| JP2013030759A | ||||
| JP5275489A |
Attorney, Agent or Firm:
Tadahiko Inaba
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
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