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Title:
The manufacturing method of a photosensitive resin composition and a hardening film, a hardening film, an organic EL display, and a liquid crystal display
Document Type and Number:
Japanese Patent JP5941543
Kind Code:
B2
Abstract:
Provided is a photosensitive resin composition. This photosensitive resin composition contains (A) a polymer component which contains a polymer that satisfies (1) and/or (2) described below, (B) a photoacid generator, (C) an alicyclic epoxy compound having a molecular weight of less than 1,000, and (D) a solvent. (1) a polymer which has (a1) a constituent unit having a residue wherein an acid group is protected with an acid-decomposable group and (a2) a constituent unit having an epoxy group (2) (a1) a polymer which has a constituent unit having a residue wherein an acid group is protected with an acid-decomposable group, and (a2) a polymer which has a constituent unit having an epoxy group

Inventors:
Daisuke Kashiwagi
Satoru Yamada
Application Number:
JP2014522574A
Publication Date:
June 29, 2016
Filing Date:
June 20, 2013
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; G02F1/1333; G03F7/004; G03F7/40; H01L51/50; H05B33/10; H05B33/22
Domestic Patent References:
JP2009098616A
JP2012108403A
JP2012234148A
Foreign References:
WO2012169620A1
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes