Title:
Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor device
Document Type and Number:
Japanese Patent JP6328896
Kind Code:
B2
Inventors:
Toshiaki Okuda
Takahiro Sasaki
Takahiro Sasaki
Application Number:
JP2013191049A
Publication Date:
May 23, 2018
Filing Date:
September 13, 2013
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
G03F7/023; G03F7/004; G03F7/038
Domestic Patent References:
| JP2013108056A | ||||
| JP2013006265A | ||||
| JP2012252095A | ||||
| JP2012226148A | ||||
| JP2013228416A | ||||
| JP2005345795A |
Foreign References:
| WO2005007718A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima