Title:
SEMICONDUCTOR CHIP MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2016058474
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacturing method which can reduce a cutting width narrower then the existing width.SOLUTION: A semiconductor chip manufacturing method comprises: a process of forming fine grooves 140 on a surface side along a cutting region from the surface of the substrate by anisotropic dry etching; a process of irradiating laser beams on the inside of the substrate along the fine grooves 140 of the cutting region to form reformed regions 320, 330 and the like along the cutting region and inside the substrate; and a process of applying stress to the substrate to divide the substrate along the cutting region into a plurality of semiconductor chips.SELECTED DRAWING: Figure 6
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Inventors:
HASHIMOTO TAKAHIRO
ONO KENICHI
MURATA MICHIAKI
IKOMA HIDEYUKI
OTSUKA TSUTOMU
ONO KENICHI
MURATA MICHIAKI
IKOMA HIDEYUKI
OTSUKA TSUTOMU
Application Number:
JP2014182137A
Publication Date:
April 21, 2016
Filing Date:
September 08, 2014
Export Citation:
Assignee:
FUJI XEROX CO LTD
International Classes:
B23K26/53; H01L21/301; H01L21/3065
Domestic Patent References:
| JP2003338468A | 2003-11-28 | |||
| JP2007294612A | 2007-11-08 | |||
| JPH09323300A | 1997-12-16 | |||
| JP2014049514A | 2014-03-17 | |||
| JP2011181909A | 2011-09-15 | |||
| JP2011249384A | 2011-12-08 | |||
| JP2014069981A | 2014-04-21 |
Attorney, Agent or Firm:
Kyozo Katayose
Shuhei Katayama
Shuhei Katayama
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