Title:
A manufacturing method of a piezoelectric sensor
Document Type and Number:
Japanese Patent JP6004123
Kind Code:
B2
Abstract:
A sheet-like flexible printed substrate (3) having a copper foil (50) affixed to the entirety of one main surface thereof is prepared (S1). Conductor patterns are formed (S2) on the one main surface of the flexible printed substrate (3). The flexible printed substrate (3) is stamped with a press die, and a flexible printed substrate (30) is formed (S3). An adhesive agent is used to affix (S4) a piezoelectric film (31) to the top of a first detection electrode (34) of a substrate section (36). The substrate section (36) in a state of having had the piezoelectric film (31) affixed to the top of the first detection electrode (34) thereof is pressed (S5). A substrate section (37) is folded back, the adhesive agent is used to affix a second detection electrode (35) to the piezoelectric film (31), and the piezoelectric film (31) is sandwiched (S6) between the first detection electrode (34) and the second detection electrode (35). A sensor unit (16) in a state in which the piezoelectric film (31) is being sandwiched is pressed (S7).
Inventors:
Hideki Kawamura
Hiroyuki Nakaji
Yoshihiro Yamaguchi
Jun Endo
Makoto Saito
Hiroyuki Nakaji
Yoshihiro Yamaguchi
Jun Endo
Makoto Saito
Application Number:
JP2015554819A
Publication Date:
October 05, 2016
Filing Date:
December 19, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G01L1/16; G06F3/041; H01L41/047; H01L41/053; H01L41/113; H01L41/193
Domestic Patent References:
| JP2009080090A | 2009-04-16 | |||
| JP2009053109A | 2009-03-12 | |||
| JPH0267207U | 1990-05-22 | |||
| JP2008122215A | 2008-05-29 |
Foreign References:
| WO2011138903A1 | 2011-11-10 | |||
| US20020036446A1 | 2002-03-28 |
Attorney, Agent or Firm:
Kaede International Patent Office