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Title:
POLYAMIDE-IMIDE RESIN-BASED HEAT RESISTANCE RESIN COMPOSITION, HEAT RESISTANT COATING AND COATED FILM USING THE SAME, MANUFACTURING METHOD OF COATED FILM PLATE
Document Type and Number:
Japanese Patent JP2017115014
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide-imide resin-based heat resistant resin composition excellent in heat resistance and adhesiveness after high temperature curing at 350°C or more and further processability, a coating having the heat resistant resin composition as a coated film component and a coated film using the same, a manufacturing method of a coated film plate.SOLUTION: There is provided a polyamide-imide resin-based heat resistant resin composition containing (A) a polyamide-imide resin and (B) an antioxidant. Number average molecular weight of the (A) polyamide-imide resin is preferably 10,000 to 50,000. The (B) antioxidant is preferably 0.01 to 10 pts.mass based on 100 pts.mass of the (A) polyamide-imide resin. Further (C) a solid lubricant is preferably contained.SELECTED DRAWING: Figure 1

Inventors:
YOTSUYA SEIICHI
Application Number:
JP2015251458A
Publication Date:
June 29, 2017
Filing Date:
December 24, 2015
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L79/08; C08K3/24; C08K5/098; C08K5/39; C08K5/521; C08L27/18; C09D7/12; C09D179/08; C10M135/18; C10M149/18