The manufacturing method of a polyimide temporary fastening agent and a temporary fastening agent film membrane formation board, a manufacturing method of a two-layer temporary fastening agent film membrane formation board, a manufacturing method of a semiconductor compound board, and a manufacturing method of semiconductor electronic parts

Japanese Patent JP6213977

B2

PROBLEM TO BE SOLVED: To provide a polyimide temporary fixative enabling, on an occasion for executing a work for processing a compact semiconductor substrate having a small diameter or a small piece shape by using a semiconductor process device accessorizing a large-sized transportation system, the work by temporarily fixing the compact semiconductor substrate to a substrate transportable by the device.SOLUTION: A polyimide temporary fixative endowed with chemical resistance, adhesive strength, heat resistance, and a function of peeling as a result of heating at a high temperature is used as a temporary fixative for temporarily fixing a compact semiconductor substrate to an adaptation substrate for reshaping the compact semiconductor substrate as a substrate adaptable to a semiconductor production work device transportation system so as not only to enable the transportation thereof to the device but also to ultimately eradicate the need for detaching the compact semiconductor substrate from the composite substrate.

Taro Itaya
Hiroyuki Ishii

JP2013000948A

October 18, 2017

January 08, 2013

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National Institute of Advanced Industrial Science and Technology

C09J179/04; C09J11/04; C09J11/06; H01L21/683

JP2012052031A
JP2011204793A
JP7118625A
JP2013001847A
JP10130616A

Kenzo Fukuda
Shinichi Fukuda
Kyosuke Kato

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