A manufacturing method of a positive type photosensitive resin composition, an insulating film formed from now on, an organic light emitting element, and a positive type photosensitive resin composition

Title:

Document Type and Number:

Japanese Patent JP5911580

Kind Code:

B2

Abstract:

This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.

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Inventors:

Park, Seung Hyun
Kim Byung-ki

Application Number:

JP2014528309A

Publication Date:

April 27, 2016

Filing Date:

September 24, 2012

Export Citation:

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