Title:
POWER CONVERSION APPARATUS AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2017183699
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a power conversion apparatus which allows an electrical connection in a power module to be performed without giving a damage to semiconductor elements.SOLUTION: A second lead frame 35 is set onto a conductive layer 26 and a busbar 23, as shown in Fig. 3(d). The second lead frame 35 has holes previously formed at both ends thereof, and solder material 36, 37 are inserted into the holes. Then, the solder materials 36, 37 are vibrated by an ultrasonically vibrating tool, as shown in Fig. 3(e). The solder materials 36, 37 are melted without having a high temperature. The connection of the second lead frame 35 is thus completed. A semiconductor element 22 and the busbar 23 are connected by a first lead frame 31 and the second lead frame 35. The second lead frame 35 that is not directly in contact with the semiconductor element 22 is bonded by ultrasonic bonding, so that the risk of damage to the semiconductor element 22 is eliminated.SELECTED DRAWING: Figure 3
More Like This:
Inventors:
ISHII TAKASHI
SAITO SHINYA
SAITO SHINYA
Application Number:
JP2016240317A
Publication Date:
October 05, 2017
Filing Date:
December 12, 2016
Export Citation:
Assignee:
KEIHIN CORP
International Classes:
H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| JP2007243157A | 2007-09-20 | |||
| JP2012204366A | 2012-10-22 | |||
| JP2013016629A | 2013-01-24 | |||
| JP2015106685A | 2015-06-08 | |||
| JP2014157927A | 2014-08-28 | |||
| JP2843814B2 | 1999-01-06 | |||
| JP2014175432A | 2014-09-22 |
Attorney, Agent or Firm:
Yoichiro Shimoda
Norimasa Shimoda
Katsuhiko Sumiyoshi
Tadanori Masanori
Toshitake Nozaki
Norimasa Shimoda
Katsuhiko Sumiyoshi
Tadanori Masanori
Toshitake Nozaki