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Title:
A manufacturing method and a program of a substrate processing device and a semiconductor device
Document Type and Number:
Japanese Patent JP6038288
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a processing chamber housing a substrate, a vaporizer which vaporizes processing liquid and supply processing gas into the processing chamber, a reserve tank storing the processing liquid, a line switching unit connected to the reserve tank, a tank supply pipe connected to the line switching unit and supplies the processing liquid to the reserve tank, an exhausting unit connected to the line switching unit and exhausts the processing liquid in the reserve tank, and a controlling unit which controls the line switching unit to exhaust the processing liquid for exhausting the processing liquid from the reserve tank to the exhausting unit and exhaust the processing liquid in the pipe for supplying the processing liquid from the tank supply pipe to the exhausting unit before and/or after supplying the processing liquid from the processing liquid supplying pipe to the reserve tank.

Inventors:
Tadashi Kontani
Hideto Tateno
Junji Umekawa
Application Number:
JP2015508548A
Publication Date:
December 07, 2016
Filing Date:
March 25, 2014
Export Citation:
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Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/31; C23C16/448; H01L21/316
Domestic Patent References:
JP2006193801A2006-07-27
JP2010059483A2010-03-18
JPH0817749A1996-01-19
JP2007138240A2007-06-07
JP2006193801A2006-07-27
JP2010059483A2010-03-18
JPH0817749A1996-01-19
JP2007138240A2007-06-07



 
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